Thermal Solution (Woodpecker, Robin)
From ToradexWiki
In general, Robin and Woodpecker need a thermal solution. This may be:
- Fan blowing air directly on the module
- Heatspreader mounted on the module (The Heatspreader is not designed for emitting heat to ambient)
- Heatspreader + suitable Heatsink for Heatspreader
- Heatsink (Robin) mounted on the module
- Fan blowing air to the mounted Heatspreader
- Fan blowing air to the mounted Heatsink (Robin)
- Heatspreader mounted on the module and connected thermally to the case
- Case connected thermally to the module
Exceptions can be:
- Woodpecker/Robin Z510 running in cold environment
- Woodpecker/Robin Z510 running in environment with high air flow
Woodpecker has the doubled PCB size than Robin, hence the thermal management on Woodpecker is less critical.
